TDA3MDDBABFQ1
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TDA3MDDBABFQ1

Category:
Manufacturer:
Description:
LOW POWER SOC W/ FULL-FEATURED P
Package:
Packaging:
Tape & Reel (TR)
RoHS：
YES

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Specifications
Part Status
Active
Operating Temperature
-40°C ~ 125°C (TJ)
Primary Attributes
-
RAM Size
512KB
Peripherals
DMA, POR, PWM, WDT
Flash Size
-
Number of I/O
126
Package / Case
367-BFBGA, FCBGA
Supplier Device Package
367-FCBGA (15x15)
Architecture
DSP, MPU
Core Processor
ARM® Cortex®-M4, C66x
Connectivity
CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed
212.8MHz, 500MHz
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